Implementing “Bleeding Edge” SMT Technology

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$199 Registration Fee Includes a Buffet Lunch in the VIP Sky Box

 

Course Instructor: Phil Zarrow, ITM Consulting

Objectives of the Course: The circuit board assembler is constantly challenged by components that seem to defy logic and manufacturability. Passives such as 0201s and 01005s, while bringing happiness to the designer with regard to layout densities are the bane of the assembler. IC packaging also has adhered to the mantra of “smaller, faster” taunting the assembler with land-grid arrays (or no lead packages) and high-density CSPs and Flip-chips. Yet, manufacturing PCBAs with these “bleedking edge” components is not insurmountable, (though not for the weak of heart).

This advanced course is intended to provide the experienced participant with a thorough yet practical approach towards dealing with the most challenging of component packages. The very latest and best methodologies and philosophies regarding process optimization will be presented and discussed. Optimizing the SMT assembly process, as it pertains to very small and high-density components will thus be covered, step by step including DFM guidelines, solder paste, Screen/Stencil Printing, Component Placement, Reflow, Inspection and Rework. The impact of lead-free and RoHS compliance will, of course, also be discussed. Case studies based upon the instructor’s experience will be presented.

Advanced SMT Manufacturing Course

Topics Covered:

I. Component Issues

  • Very Small Passives
    • 0201s
    • 01005s
  • ICs
    • LGAs and NQFPs
    • CSPs and Flip-chips
  • Moisture Sensitive Devices (MSDs)
    • Issues and Specifications
    • Tracking

II. Design for Manufacturability Considerations (Overview)

  • Pad design – Round vs. Square
  • Solder Mask considerations
  • Via in Pad
  • Component layout proximities
  • Lead-free PCB finishes

 III. Solder Paste

  •   Solder Paste Composition and Behavior:
    • Type 3, 4 and 5
  • Recommendations for 0102 and 01005s

IV. Solder Paste Printing and Deposition

  • Deposition Basics
  • Screen and Stencil Engineering
    • Stencil Thickness
    • Aperture shape and design
  • Variables and Control
  • Machine Elements and Parameters

 

V. Automatic Component Placement

  • Feeder considerations
  • Vision considerations
  • Variables and Control

VI. SMT Soldering

  • Reflow Soldering Considerations
  • Variables and Controls
  • Reflow characteristics and challenges of high-mass IC packages
  • Reflow of lead-free area arrays in SnPb processes

VII. Inspection, Verification and Rework

  • Solder Joint Quality and Reliability
  • Inspection Methodology and Equipment
  • In-Process Inspection
  • Automated Optical Inspection (AOI)
  • X-Ray and X-Ray Laminography Inspection
  • Electrical Verification Techniques
    • JTAG
    • Flying Probe and ICT
  • Rework Methodologies

 VIII. General Discussion and Q&A

Who Should Attend: This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are experienced in SMT assembly and want to further their expertise in implementing and optimizing the incorporation of Very Small Passives and high-density ICs in their SMT assembly processes