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Solder Paste Evaluation and Qualification
Register: Click here for secure Site
$99 Registration Fee (Don't Register if signed up for 10 Deadly Sin's Seminar)
Course Instructor: Phil Zarrow, ITM Consulting
Description & Objectives of the Course:
Solder paste is the most fundamental materials for most SMT assemblies. Yet very few users know how to qualify and evaluate the solder paste appropriate to their process. This course is intended to provide the participant with an understanding of how to evaluate and select the solder paste best suited for the application including circuit board composition and assembly environment. There will be an initial discussion of the composition and characteristics of solder paste and how this relates to the assembly process, particularly deposition and re flow. Cleaning and No-clean processes will also be considered. Comprehensive, yet easy to perform evaluation procedures are then presented to for evaluating and identifying the best qualified solder paste for the process. The course will provide the tools for the participant to properly assess solder paste in his/her facility.
SMT Solder Paste Evaluation Course
Topics Covered:
I. Solder Paste Basics
What is Solder paste
Metal component
Chemical components
II . Process Considerations
Printing and Deposition
Re flow
Solder Paste Characteristics
III. Solder Paste Evaluation Tests
Quantitative Solder Ball Test
Residue Evaluation
Slump Tests
Wetting Tests
Standard
OSP
Tack Tests
Work-life Tests
Chip-Shooter Compatibility Test
IV. The Vendor-User Relationship
Technical Support
Source considerations
Who Should Attend:
This course is intended for Manufacturing, Process, and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies utilizing solder paste and wish to lower their defect rate through the use of the best solder paste for their respective processes.
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